Question
In the silver plating of copper, is used instead of . The reason is:
A thin layer of Ag is formed on Cu
More voltage is required
ions are completely removed from the solution
Less availability of ions, as Cu can not displace Ag from ion
Copper is more reactive than silver ( and ). If a simple salt like is used, Cu will spontaneously displace Ag from the solution via the redox reaction , leading to a loose and non-adherent deposit of silver. To get a smooth, uniform, and adherent coating of silver by electrolysis, the concentration of free ions must be kept very low. is a highly stable complex salt that dissociates very little, providing a very low concentration of free ions. At this low concentration, copper cannot displace silver chemically, and deposition occurs only when an external electric current is passed.
This question aligns with the NEET CHEMISTRY syllabus, specifically targeting concepts from Electrochemistry. Mastering this topic is crucial for scoring well in the upcoming medical entrance examinations. Solving conceptually related problems will help you understand the nuances of these concepts and improve your problem-solving speed.
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